Recent Headlines
August 15, 2008
LORD Corporation Works with Stern Manufacturing to Reduce Costs, Streamline Operations
In today's global marketplace, it is pretty common for a large customer to ask their supplier to find a better and cheaper way to make their product. [ more ]
August 7, 2008
LORD Corporation Names Delores Etter to Board of Directors
LORD Corporation has announced that Delores M. Etter, Ph.D., has joined its Board of Directors. [ more ]
July 21, 2008
LORD Corporation Develops Higher Performance Gelease Material
LORD Corporation has developed a new high-performance Gelease™ material. [ more ]
July 21, 2008
LORD Corporation Develops Non-Silicone Thermal Die Lid Attach
LORD Corporation has developed a non-Silicone Thermal Die Lid Attach (TDLA) Adhesive. [ more ]
July 21, 2008
LORD Corporation Develops 5W & 6W High-Conductivity Thermal Greases
LORD Corporation has developed high thermal conductivity greases designed to maximize the heat transfer from high-end chips to the heat spreader. [ more ]
July 21, 2008
LORD Corporation Develops Thermally-Conductive Flip Chip Underfill Technology
LORD Corporation has developed a thermally conductive flip chip underfill that offers an improved thermal path for heat reduction. [ more ]