|
Circalok 6009 A/B |
Low viscosity, various colors epoxy encapsulant, UL94V-0 |
|
Circalok 6031 |
Semi-rigid, high temperature, excellent arc track resistance epoxy encapsulant |
|
Circalok 6703 |
Thermally conductive silicone, UL94V-0 |
|
LS213-9 |
Unfilled, room-temperature stable consumer-grade underfill with long pot life for package on laminate |
|
SC-102 |
Unfilled, repairable, excellent thermal shock resistance silicone encapsulant |
| SC-300M |
Electronic grade silicone gel encapsulant |
| SC-303 |
High thermally conducte encapsulating system, UL94V-0 |
| SC-309 |
Thermally conductive silicone encapsulating system, UL94V-0 |
| SC-2002HV UV |
One-component, low temperature cure silicone conformal coating |
| UR-312 |
Microelectronic grade, clear, low modulus urethane encapsulating gel |
| UR-322 |
Two-component, room temperature curing urethane potting compound |
| UR-325 |
Black, hydrolytic and elevated temperature stable encapsulation system |
| UR-340 |
Flexible, low viscosity urethane encapsulant |