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Circuit Assembly Materials
Chip-on-Board Encapsulants
| MA-511 |
One-component, thixotropic epoxy adhesive/sealant |
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ME-430 |
Glob-top encapsulant, high purity epoxy |
| ME-455 |
Cavity fill encapsulant, high purity, fast cure |
| ME-456 |
One-component, high purity, fast cure dam material |
| MS-330 |
Single-component, heat cure, medium viscosity silicone |
Consumer Grade Glob-Top Encapsulant
| Circalok EP-937 |
Glob-top encapsulant, extra fast curing, electronic grade epoxy |
Silver-Filled Adhesives
| MD-140 |
Die attach adhesive with 12 W/mK thermal conductivity |
| MD-150 |
Electrically conductive die attach adhesive for general purpose applications |
| MD-161 |
Electrically conductive die attach adhesive with good adhesion to silicon carbide |
Underfill Encapsulants
| CircuitSAF™ ME- 525 |
Flip-chip underfill for high performance chip on laminate & molded on laminate applications |
| CircuitSAF ME-531 |
High Tg flip-chip underfill for chip on laminate applications |
| ME-532 |
Flip-chip underfill for low stand-off, high density chip on laminate applications |
| ME-541 |
Anhydride-free flip-chip underfill for low stand-off, high density chip on laminate applications |
| ME-542 |
Thermally conductive, anhydride-free flip-chip underfill for low stand-off, high density chip on laminate applications |
| LS213-9 |
Unfilled, room temperature stable consumer-grade underfill with long pot life for package on laminate |
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