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Circuit Assembly

Encapsulation

Hybrid/Thick Film

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Semiconductor Packaging

Thermal Management

Industrial Electronic Distributors

LORD Develops Encapsulant to Help Industry Leader Vicor Launch Their Next Generation Compact, High-Power Converter

Customer
Vicor Corporation, manufacturer of power conversion devices for military, telecommunications and industrial uses.

Challenge
with the development of the new generation of smaller but higher power converters, Vicor needed an encapsulant with three time the thermal conductivity as the existing technology. To meet production demands, Vicor also needed to have a low viscosity, fast-flowing material to ensure complete encapsulation using their proprietary filling process.

Solution
LORD Corporation’s development chemists designed a new silicone formulation using unique raw materials and processes that offered >3 W/mK thermal properties along with a viscosity < 25,000 cps.

Results
The new material from LORD Corporation allowed Vicor to meet their converter package heat dissipation requirements without having to change manufacturing processes for high volume production.

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